Avand Danesh :: Electronic Packaging

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Electronic Packaging (10)

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Wiley Titles in Electronic Packaging

Advanced Electronic Packaging, 2nd Edition

by Ulrich

ISBN: 978-0-471-46609-3

May 2006, Hardcover, Wiley-IEEE Press

Advances in Embedded and Fan-Out Wafer Level Packaging Technologies

by Keser

ISBN: 978-1-119-31413-4

March 2019, ©2018, Hardcover, Wiley-IEEE Press

IC Component Sockets

by Liu

ISBN: 978-0-471-46050-3

April 2004, Hardcover

LED Packaging Technologies: Principles and Implementation

by Lee

ISBN: 978-1-118-88147-7

October 2015, Hardcover

Low Temperature Sintering of Nanometals: Toward the Future Green Printed Electronics

by Yang

ISBN: 978-1-119-02318-0

December 2015, Hardcover

Mitigating Tin Whisker Risks: Theory and Practice

by Kato

ISBN: 978-0-470-90723-8

August 2016, Hardcover

Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing

by Liu

ISBN: 978-0-470-82780-2

October 2011, Hardcover

Operational Amplifiers: Integrated and Hybrid Circuits

by Rutkowski

ISBN: 978-0-471-57718-8

March 1993, Hardcover

SiP-System in Package Design and Simulation: MentorGraphics Expedition Enterprise Flow Advanced Design Guide

by Li

ISBN: 978-1-119-04593-9

November 2017, ©2016, Hardcover

Thermal Management of LED Packages and Applications

by Luo

ISBN: 978-1-119-17927-6

February 2017, Hardcover

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