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Thermal Management of LED Packages and Applications
Luo
ISBN: 978-1-119-17927-6
Hardcover
300 pages
February 2017
Title in editorial stage
  • Description

Written by a leading expert in LED packaging technologies, this book systematically introduces fundamental theory and practical design approaches to IC/LED product design. Readers get a good grounding in thermal management strategies with topics such as heat transfer fundamentals, thermal modeling, and thermal simulation and design. Additionally, cooling technologies and testing techniques are provided to help readers evaluate device performance and to shorten the design and manufacturing cycle.

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