Low Temperature Sintering of Nanometals: Toward the Future Green Printed Electronics

This book provides comprehensive coverage of the recent advances in low temperature sintering techniques for the purpose of conductive track (printed circuit) formations. It is one of the core techniques for the development of the next generation of consumer electronic devices. The authors describe the basic mechanism of low temperature sintering techniques and show a series of current technical advances which will potentially change the current printed circuit technology over the next decade. These technical advances include basic chemistry, applied physics, materials engineering methods, microelectronic fabrications, and advanced instrumentations. The authors systematically introduce each advance in detail, showing how they correlate with each other, and how they impact on electronic manufacturing infrastructure.