LED Packaging Technologies: Principles and Implementation

Light source technology has undergone a revolutionary change in the last 5 years wherein established thermal (incandescent) and discharge (fluorescent and HID) lamps developed over many decades have been in major part replaced and displaced by light-emitting diode (LED)-based solid-state lighting (SSL). The book aims to provide a practically-based overview of the design and construction of LED lighting modules from the fabrication of the LED chip through to the LED modules that are incorporated in complete LED lighting fixtures.  Solid-state lighting (SSL) has major advantages such as energy saving, environmental friendliness, and long operational life. Packaging of light-emitting diode (LED) is the major enabling technology to achieve these merits. This book will review the technology trends of lighting sources and introduce the features of LED. Technical issues in packaging LED components such as interconnection, phosphor deposition, and encapsulation will be elaborated in detail. Considerations in thermal management and reliability will be evaluated. Efforts will also be made to elaborate on optical design, analysis and characterization. Applications of LED for general SSL and special lighting will be highlighted. Furthermore, technology roadmap and IP issues will be discussed. The outline of contents is listed as shown below: 

•     Overview on Lighting, Photometry, and Colorimetry
•     Fundamentals of Light-Emitting Diodes
•     Fabrication of LED Wafers and Chips
•     Packaging of LED Chips
•     Wafer Level Packaging of LED Arrays
•     Board Level Assembly and LED Modules
•     Optical and Electrical Characterization
•     Thermal Management and Considerations
•     Reliability Engineering for LED Packaging
•     Further Discussion on Packaging Materials
•     Applications and Considerations for General Lighting
•     Future Outlook and Technology Roadmap